铸造服务

以及用于相应的器件制造工艺的设备的研究和开发,整个过程 或由客户提供 它提供代工服务的完整的产品开发过程,包括设计和定制开发.

  • 仔细看
  • 仔细看
  • 仔细看
  • 仔细看
  • 仔细看
  • 仔细看

Mass product or coordinator for power devices form wafer in to wafer out total solution

艺术
Front-end processing
Photolithography resolution down to 0.4 µm feature with 0.1µm alignment accuracy
Trench technology down to 3um depth without micro trench
Thermal oxidation and gate stack processes
Films deposition and etch
High temperature implant
High temperature implant anneal
Metallization
Backside metal deposition
Ni, Al, Ti/TiN Ag deposition and etch
Semiconductor device and test patterns
Fabrication of test structures
Manufacturing of semiconductor devices
Characterization
Inline parametric and reliability electrical testing and characterization
设施
4-inch SiC processing capabilities
SiC capacity: 1500 wafers/month
Class-10 capable cleanroom
Custom development and manufacturing